Vapor chamber

ABSTRACT

A vapor chamber comprises a flat metal tube formed of a circular metal tube by pressing, a powder sintering portion disposed on the inner wall of the metal tube, a supporting structure disposed in and surrounded by the metal tube, a working fluid filled in the metal tube; wherein the top and bottom sides of the metal tube are flat, the two opposite sides connecting the top and bottom sides are seamlessly circular arc shaped, and the other two opposite sides are the sealed ends formed of the two open ends by pressing and sealing. The present invention provides a vapor chamber for CPU, GPU, LED solar cell or other high heat producing electronic products to solve the heat dissipation issues.

CROSS REFERENCE TO RELATED APPLICATIONS

The present application claims priority under 35 USC 119 to Chinese Patent Application No. 201010180396.4, filed May 15, 2010, the contents of which are incorporated herein by reference.

FIELD OF THE INVENTION

The present invention relates to a vapor chamber.

BACKGROUND

Nowadays the electronic products on the market are becoming more and more powerful, operating at high speeds can produce a great amount of heat, but the conventional heat dissipating devices used for these products are usually aluminum extruding heat dissipating fins or with fans, which are more or less insufficient for these powerful electronic products. As a result, in the associated industries many manufacturers are continuously to develop new heat dissipating devices using new technologies such as heat pipes and vapor chambers, in which a type of vapor chambers which feature in fluid-vapor two-phase conversion have a widespread use as these vapor chambers provide a wide and flat surface contacting with the electronic products, allowing the heat generated by these electronic products to dissipate in a plane radiation way. In comparison with the unidirectional heat pipe heat dissipating devices, these vapor chamber heat dissipating devices are able to provide better heat dissipation by universal directions, lower heat resistance and higher heat conductivity.

As FIG. 1 shows, a recent vapor chamber usually consists of an upper cover 01, a lower cover 02 and a supporting element 03 disposed between the upper cover 01 and the lower cover 02, in production, all elements are placed between the covers before the covers are pressed. However this technique is rather difficult: if the wall of the covers is too thin, the covers will easily sink along with the supporting element 03; but if the wall of the covers is too thick, the weight of the vapor chamber produced will easily exceed the design standard. Moreover, as usually a vapor chamber is quite large, the sides thereof are correspondingly long, therefor any small defects of pressing and welding in these sides may become the potentially risky spots in which the covers may split off in a high temperature. Thus, according to the descriptions above, it is obvious that the conventional manufacturing techniques of vapor chambers are complicated and difficult, consequently low in efficiency and high in manufacturing costs.

A basic configuration for a finished vapor chamber product comprises a cover with a vacuum chamber, in which a micro-structure is provided and filled by the working fluid; the heat conduction is realized by the heat absorption and dissipation of the working fluid in condensation and evaporation, and the capillary force generated by the micro structure on the working fluid. In addition, the vacuum in the cavity of the vapor chamber is required, the current producing technologies, whatever the chamber formed of a upper and a lower covers, or the chamber formed of a copper tube shaped, as shown in FIG. 2, all comprise several common steps: a step for powder filling and capillary structure sinter-forming, a step for supporting structure forming and chamber profiling, a step for sealing by argon welding or silver brazing and inserting a fine metal pipe as a fluid injection port, a step for injecting working fluid via the fluid injecting port, and a final step for chamber vacuuming and fluid injection port sealing.

However, the recent vapor chamber manufacturing method described above have the following shortcomings:

Firstly, the vapor chambers or semi-finished vapor chamber produced by foregoing steps all have a fine metal pipe as the reserved fluid injection port, which is shown as FIG. 3, in which 1 is a semi-finished vapor chamber, 101 is the sealing structure, 102 is the fine metal pipe. The semi-finished vapor chamber with such a structure may be easily damaged because of an accidental collision, consequently to cause higher rejection rate.

Furthermore, in the later manufacturing steps of working fluid injection, vacuum pumping, and sealing, the recent methods use an injector to inject the working fluid into the vapor chamber through the fine metal fluid injection pipe, and then remove the injector when the fluid injected achieve a certain volume, and then pass the semi finished vapor chamber to another work station for vacuum pumping and sealing. This procedure is rather complicated, time consuming and has high manufacturing costs.

In addition to above, because of the high vacuum in the cavity of the vapor chamber, the approach of using a same port for fluid injecting and vacuum pumping may result in a phenomenon of the rapid vaporization of the working fluid injected while the working fluid is being injected, which may lead to insufficient working fluid in the vapor chamber and consequently a so-called “dry out” phenomenon.

SUMMARY OF THE INVENTION

The object of the present invention is to provide a vapor chamber with more reasonable structure, higher heat-dissipation efficiency, lower manufacturing costs, and minimized sealing defects.

A vapor chamber disclosed by the present invention comprises a flat metal tube formed of a circular metal tube by pressing, a powder sintering portion on the inner wall of the metal tube, a supporting structure positioned in and surrounded by the metal tube, a working fluid filled in the metal tube; wherein the top and bottom sides of the metal tube are flat, and the two opposite sides connecting the top and bottom sides are seamlessly arc shaped; the other two opposite sides are the sealed ends formed of the two open ends by pressing and sealing, the total length of the sealed ends is equivalent to the length of the internal circumference of the metal tube.

The supporting structure is formed by metal injection molding. The supporting structure is a plate with a plurality of projections. The projections are alternately distributed on both sides of the supporting structure in a trapezoidal wave form.

The projections are distributed on one side of the supporting structure only in a trapezoidal wave form.

A manufacturing method for the vapor chamber comprises following steps:

Step 1 , material preparation: preparing the raw metal material for the vapor chamber, and cutting said metal material to predetermined dimensions;

Step 2, powder filling and sintering: filling the cavity of said metal material with the raw powder screened, and sintering said metal material after filling;

Step 3, supporting structure filling: filling the cavity of said metal material with a supporting structure;

Step 4, the first pressing: reserving one portion of an opening of said metal material as a fluid injection port and pressing the rest of portions of the opening;

Step 5, the first sealing: sealing said metal material except the portion of the opening reserved as a fluid injection port;

Step 6, fluid injection: injecting the quantified working fluid into the cavity of said metal material through said fluid injection port; and

Step 7, vacuum processing: preparing a vacuum chamber comprising a vacuum pumping device, a pressing device, a seal welding device, and an observation window for the operator to observe the internal conditions therein; placing at least one semi-finished vapor chamber into said vacuum chamber, and pressing and sealing said fluid injection port.

In the above steps, no fluid injection pipe is involved, thereby avoiding problems of being easily damaged in manufacturing.

The advantages of adopting the manufacturing steps provided by the present invention could be: in the flattened metal tube provided by the present invention, a metal powder sintering structure is provided, the metal tube is hollow, and filled with a high temperature resistance supporting structure, such a supporting structure can be formed by metal injection molding, and provides higher temperature resistance, lighter weight, and higher hardness than most of other metal structures, and therefore may be the best choice for the supporting structure used in the vapor chamber.

Furthermore, preferably, the supporting structure is provided with plurality of projections, which are alternately distributed on both sides of the plate in a trapezoidal wave form, allowing an even spread of the pressure applied on the surface of the vapor chamber and preventing the vapor chamber from collapse or deformation. Resulting from above, the vapor chamber provided by the present invention can effectively and efficiently solve the problems of heat dissipation in use of the high heat producing electronic products, i.e., CPU, GPU, LED or solar cell and etc.

Unlike other existing methods in which an injection pipe is welded into the semi product, the vapor chamber manufacturing method disclosed by the present invention reserves a part of the opening of the metal tube as a fluid injection port after the first sealing in step 5. After the step of fluid injection, the semi-finished vapor chamber is vacuumed and sealed, in detail, the semi product is placed and fixed in a work holder of the vacuum chamber for further processes including the pressing and sealing of the fluid injection port. The fine metal pipe is no longer required in the vapor chamber produced by such steps, eliminating possibilities of being unable to inject fluid due to the damage on it caused by accidental collision or pressure in manufacturing. Moreover this method allows an integrated operation of vacuuming and sealing in the vacuum pumping chamber, thereby eliminating the disadvantages caused by the pressure difference between the interior and exterior of the cavities of the vapor chamber, and providing products with higher quality, lower rejection rate and enhanced heat dissipating performance.

Those skilled in the art would be able to understand the other advantages and objects of the present invention after reading this disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The advantages, features, and exemplary embodiments of the present invention will be better understood by the following description when considered in conjunction with the accompanying drawings in which:

FIG. 1 is an exploded view of an existing vapor chamber;

FIG. 2 is a flow diagram of an existing vapor chamber manufacturing method;

FIG. 3 is a schematic view of a semi-finished vapor chamber produced by an existing manufacturing method;

FIG. 4 is a process flow diagram of the first embodiment of the present invention;

FIG. 5 is a process flow diagram of the second embodiment of the present invention;

FIG. 6 is a schematic view of a semi-finished vapor chamber produced by the method provided by the present invention;

FIG. 7 is a schematic view of a semi-finished vapor chamber provided by the present invention in a vacuum chamber;

FIG. 8 is a schematic view of a sealed vapor chamber provided by the present invention;

FIG. 9 is a schematic view of a metal tube provided by the present invention;

FIG. 10 is a schematic view of a vapor chamber provided by the present invention;

FIG. 11 is a sectional view of the section A-A in FIG. 10;

FIG. 12 is a sectional view of the section B-B in FIG. 10

FIG. 13 is a schematic view of a supporting structure in the first embodiment of the present invention;

FIG. 14 is a schematic view of a supporting structure in the second embodiment of the present invention.

DETAILED DESCRIPTION

As shown by the process flow diagram of the first embodiment of the present invention in FIG. 4, wherein the metal material used in this embodiment is a metal tube, the method comprises the following steps:

Step 1, material preparation: preparing the metal material of the vapor chamber, and cutting the material to predetermined dimensions; as using metal tube, some sub-steps for processing the metal tube are includes:

-   -   Cutting: cutting the raw metal tube to predetermined dimensions,         straightening the raw metal tube before cutting to ensure the         yield of the final product, and washing the metal tube after         cutting to ensure the quality of the cavity of the metal tube;         and     -   Rod insertion: inserting a mold rod matching with the internal         diameter of the metal tube into the cavity of the metal tube,         wherein the mold rod will be sintered with the raw powder in a         later step to form the required structure in the cavity of the         metal tube.

Step 2, powder filling and sintering: filling the cavity of the metal tube with the raw powder screened, and sintering the raw powder therein to form a capillary structure; this step can be further divided into several sub-steps:

-   -   Powder filling: filling the cavity of the metal tube with the         raw powder through an opening of the metal tube;     -   Sintering: sintering the metal tube with the raw powder therein;         and     -   Rob removing: removing the mold rod from the metal tube.

Step 3, supporting structure filling: filling the cavity of the metal tube with a supporting structure; as in this embodiment the metal tube is used, this step is further divided into:

-   -   Pre-pressing: pressing the circular metal tube to form a flat         tube;     -   Supporting structure filling: filling the cavity of the metal         tube with the supporting structure through an opening of the         metal tube, wherein the supporting structure is formed by         punching, shaping and washing, and provides support for the         metal tube.

Step 4, the first pressing: the metal tube has a first and a second opening respectively on the ends thereof, in this step, one portion of the first opening is reserved as a fluid injection port 100, and the rest of the first opening and the second opening are pressed.

Step 5, the first sealing: sealing the metal tube except the portion reserved as the fluid injection port 100 to form a semi finished vapor chamber, shown as FIG. 6, wherein 1 is the semi finished vapor chamber, 100 is the fluid injection port.

Step 6, fluid injection: injecting the quantified working fluid into the cavity of the semi finished vapor chamber 1 through the fluid injection port 100 on the first opening.

Step 7, vacuum processing: placing at least one semi finished vapor chamber 1 filled with quantified working fluid into the work holder in a vacuum chamber, pressing and sealing the fluid injection port 100, this step can be divided into:

-   -   Product positioning: placing at least one semi finished vapor         chamber 1 into the work holder in the vacuum chamber and fixing         it through a clamper 4 so that the fluid injection port 100 is         inclined upwardly with a elevation angle θ, to avoid the working         fluid in the cavity of the semi vapor chamber 1 from flowing out         through the fluid injection port 100 due to the influence of         gravity, as shown in FIG. 7.     -   The second pressing: pressing the fluid injection port 100, the         direction of the pressure is shown by the narrow in FIG. 7.     -   The second sealing: sealing the fluid injection port by spot         welding or other means so as to form a vapor chamber, shown as         FIG. 8, after that, a vapor chamber could be further processed         by other subsequent steps to form a complete heat dissipation         product, which are not described herein.

It is noted that in above steps no fine metal pipe serving as a fluid injection pipe is involved, thereby avoiding problems of being unable to inject fluid or pull it out after injection due to damage on it caused by accidental collision and pressure during manufacturing.

In the steps described above, step 7 relates to a vacuum chamber, of which main purpose is to realize the processing of vapor chamber in a vacuum environment. Thus, the vacuum chamber comprises a vacuum pumping device mounted on the inside thereof, and a control mechanism mounted on the outside thereof, such as several buttons for different functions controlling the vacuum pumping device to evacuate the air from the cavity of the vacuum chamber to form a vacuum environment. Moreover, an observation window is set on the vacuum pumping box so as to allow the operator to observe the operation of the devices. The vacuum chamber further has a controlled pressing mechanism for realize the processing steps of pressing the vapor chamber and the fluid injection port, and a controlled seal welding device for sealing the vapor chamber.

As shown by the processing flow diagram in the FIG. 12, in the second embodiment of the present invention, a metal plate is used as the raw material for the vapor chamber, so the steps of this embodiment are different with the steps of the first embodiment, comprising:

Step 1, material preparation: preparing the raw metal material of the vapor chamber, and cutting the raw material to predetermined dimensions, as using metal plates, some sub-steps for processing the metal tube comprises:

-   -   Cutting: cutting the raw metal plate to predetermined         dimensions; and     -   Punching: punching the metal plate cut into a shape required,         and washing the metal plate afterwards to ensure the quality.

Step 2, powder filling and sintering: filling the cavity of the metal plate with the raw powder screened, and sintering the metal plate with the raw powder to form a capillary structure.

Step 3, supporting structure filling: filling the cavity of the metal plate with a supporting structure.

Step 4, pressing: reserving a portion of the opening of the metal plate as a fluid injection port 100, and pressing the rest of the opening of the metal plate.

Step 5, sealing: sealing the metal plate except the portion reserved as the fluid injection port 100 to form a semi finished vapor chamber 1, shown as FIG. 6.

Step 6, fluid injection: injecting the quantified working fluid into the cavity of the semi finished vapor chamber 1 through the fluid injection port 100.

Step 7, vacuum processing: as shown in FIG. 7, placing at least one semi finished vapor chamber 1 into a work holder in the vacuum pumping box, pressing and sealing the fluid injection port 100, this step can be divided into:

-   -   Product positioning: placing at least one semi vapor chamber 1         into a work holder in the vacuum pumping box and fixing it         through a clamper 4 so that the fluid injection port 100 is         inclined upwardly with a elevation angle θ, to avoid the working         fluid in the cavity of the semi vapor chamber 1 from flowing out         through the fluid injection port 100 due to the influence of         gravity, as shown in FIG. 7;     -   The second pressing: pressing the fluid injection port 100, the         direction of the pressure is shown by the narrow in in FIG. 7;         and     -   The second sealing: sealing the fluid injection port 100 by spot         welding or other means so as to form a vapor chamber, shown as         FIG. 8.

As the preferred embodiments of the present invention, in step 6 and step 7.3, the sealing can be realized by spot welding, arc welding, argon welding, silver brazing and other sealing methods known in the art.

In above first and second embodiments, a leak hunt is conducted after the vapor chamber is finally sealed in order to ensure the quality of the final products.

In the present invention, the sealing structure of the vapor chamber is modified, a semi-finished vapor chamber is shown in FIG. 6, and a finished vapor chamber is shown in FIG. 8, it comprises a vapor chamber 1 with a vacuum cavity, a fluid injection port 100 positioned on one side the vapor chamber 1, and a supporting structure provided in the vacuum cavity of the vapor chamber for supporting the shape of the vapor chamber, wherein the fluid injection port 100, which is the major difference from the vapor chamber produced by the conventional manufacturing methods, is integrated to the vapor chamber 1 and formed after the pressing and sealing steps.

With the manufacturing method disclosed by the present invention, the extra fine metal pipe serving as a fluid injection port is no longer required, and the subsequent sealing processing steps are integrated within a vacuum chamber.

In detail, in reference to FIG. 9, 10, 11 and 12, the vapor chamber produced according to the manufacturing method in the first embodiment of the present invention, comprises a flat metal tube (here equivalent to a finished vapor chamber) formed of a circular metal tube by pressing, a powder sintering portion on the inner wall of the metal tube, a supporting structure positioned in and surrounded by the metal tube, and a certain amount of working fluid filled in the metal tube. As the two ends of the circular metal tube are open, after the flat metal tube 1 is shaped, these two open ends become elongated correspondingly, and are sealed after pressed to form two long and narrow sealed ends 14 later on, shown as FIG. 9 and 11. Furthermore, after flattened, the top side 11 and the bottom side 12 of the metal tube vapor chamber 1 become flat and wide, whilst the two opposite sides 13 connecting the top side 11 and bottom side 12 remain seamlessly arc shaped, as shown in FIGS. 9 and 10. The advantages of such a structure can be: the cover of the vapor chamber is made of the circular metal tube directly, but not the combination of two separated metal plates, it is easy for pressing, lowers the manufacturing costs and reduces the difficulty of manufacturing. Furthermore, for a cover formed of a metal tube, there are only two open ends (front and back), the opposite side ends 13 are naturally sealed, thus in the sealing step, there are only two ends required to be pressed and sealed to from the sealed ends 14, as shown in FIG. 9. The length of the one sealed end of the vapor chamber 1 is L (FIG. 10), equaling to a half of the length of the inner circumference of the original circular metal tube, thus the total length of the sealed ends of the metal tube vapor chamber is 2L, equaling to the length of the inner circumference of the original circular metal tube, an optimized design of minimizing the sealing length is achieved, ensuring the reliability of the sealing, simplifying the processing difficulty of sealing, improving the product rate and reducing the manufacturing costs. In addition, the final vapor chamber is better in sealing and minimizes the possibility of the working fluid leakage.

As a preferred embodiment of the present invention, the supporting structure 3 are formed by metal injection molding, which not only can reduce the time and costs for manufacturing the supporting structure, but also can provide a supporting structure with higher temperature resistance, lightened weigh and higher hardness, it could be the first choice of the supporting material for the vapor chamber.

In order to further improve the reliability of the supporting structure 3, preferably, the supporting structure comprises a plate 3 with a plurality of projections 31. Wherein, the projections 31 which are integrated and formed by punching or other processing techniques can ensure the strength and supporting capacity of the supporting structure 3. As FIG. 13 shows, in the first embodiment of the present invention, the projections 31 are alternately distributed on both sides of the supporting structure 3 in a trapezoidal wave form, to allow each projections (wave peaks and troughs) to support the inner walls of the vapor chamber, thus the possible pressure applied on the vapor chamber will be evenly dispersed by these wave peaks and troughs to avoid the vapor chamber from collapse or deformation. In another embodiment of the present invention, said projections 31 are also in trapezoidal wave form but distributed on one side of the supporting structure 3 only, the top ends of the said projections 31 come in contact with the inner wall of the vapor chamber, a plane contact is therefore formed. Similar to the first embodiment, the arrangement of said projections can evenly disperse the pressure applied on the vapor chamber for a better supporting performance.

In addition, as a preferred embodiment, the sealed end 14 has a tin soldering layer as welding reinforcement to enhance the reliability of the product.

The preferred specifications as well as the most common specifications for the vapor chamber provided in the present invention are listed as follows: the wall thickness of the metal tube vapor chamber is between 1.0 mm and 5.0 mm, the thickness of the powder sintering portion 2 is between 0.3 mm 1.0 mm; in addition, the total thickness of the vapor chamber is between 3 mm and 12 mm, a vapor chamber with such specifications is applicable to most electronic products on the market, and its strength also satisfies the requirements of the usual use of these electronic products, its compact structure also allows the costs to be controlled into an acceptable range.

The object of the present invention is to provide a vapor chamber with enhanced product structural strength for CPU, GPU, LED solar cell, and other high heat producing electronic products to deal with the heat dissipation issues. Another object of the present invention is to simplify the production technology of the vapor chamber by adopting a circular metal tube as raw material, and achieve higher performance with an appropriate size by a more reasonable structure, therefore it could be said that the vapor chamber disclosed by the present invention has excellent performance in the fields it is involved in.

The foregoing is considered as illustrative only of the principles of the invention. Since numerous modifications and changes will readily occur to those skilled in the art, it is not desired to limit the invention to the exact construction and operation shown and described, and accordingly, all suitable modifications and equivalents may be resorted to, falling within the scope of the invention. 

1. A vapor chamber, comprising: a flat metal tube formed by pressing a circular metal tube and having a powder sintering portion on an inner wall thereof; a supporting structure disposed in and surrounded by the flat metal tube; and a working fluid filled in the metal tube; wherein the flat metal tube further comprises top and bottom sides that are flat, and two opposite sides connecting the top and bottom sides are seamlessly circular arc shaped, and wherein two other opposite sides define sealed ends formed of by pressing and sealing the two open ends of the flat metal tube.
 2. The vapor chamber according to claim 1, wherein the total length of the sealed ends is equivalent to the length of an internal circumference of the flat metal tube.
 3. The vapor chamber according to claim 1, wherein the supporting structure is formed by metal injection molding.
 4. The vapor chamber according to claim 3, wherein the supporting structure further comprises a plate with a plurality of projections.
 5. The vapor chamber according to claim 4, wherein the projections are alternately distributed on both sides of the supporting structure in a trapezoidal wave form.
 6. The vapor chamber according to claim 4, wherein the projections are distributed on only one side of the supporting structure in a trapezoidal wave form.
 7. The vapor chamber according to claim 1, further comprising a tin soldering layer provided on the sealed ends.
 8. The vapor chamber according to claim 1, wherein the flat metal tube further comprises a wall thickness between 1.0 mm and 5.0 mm.
 9. The vapor chamber according to claim 1, wherein the powder sintering portion further comprises a thickness of between 0.3 mm and 1.0 mm.
 10. The vapor chamber according to claim 1, wherein the vapor chamber is between 3.0 mm and 12.0 mm thick.
 11. The vapor chamber according to claim 1, further comprises an integrated fluid injection port positioned on one side of the vapor chamber, and formed of one portion of the side of the vapor chamber by pressing and sealing. 